Power chips are connected to external circuits through packaging, and their performance depends upon the support of the product packaging. In high-power circumstances, power chips are normally packaged as power components. Chip interconnection refers to the electrical connection on the top surface area of the chip, which is normally light weight aluminum bonding wire in conventional components. ^
Standard power module bundle cross-section

Presently, business silicon carbide power components still mostly utilize the product packaging innovation of this wire-bonded standard silicon IGBT module. They deal with problems such as big high-frequency parasitical criteria, insufficient heat dissipation capacity, low-temperature resistance, and not enough insulation stamina, which restrict making use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to address these problems and completely exploit the massive prospective advantages of silicon carbide chips, several new product packaging innovations and options for silicon carbide power modules have actually arised in recent times.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually established from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold cables to copper wires, and the driving force is cost reduction; high-power tools have created from light weight aluminum cables (strips) to Cu Clips, and the driving pressure is to improve item performance. The better the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared with standard bonding product packaging methods, Cu Clip modern technology has the complying with benefits:

1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific level, replaces the conventional cable bonding technique between the chip and the pins. Therefore, an one-of-a-kind plan resistance value, higher present flow, and better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can fully conserve the expense of silver plating and inadequate silver plating.

3. The product look is completely consistent with normal products and is mostly made use of in servers, mobile computers, batteries/drives, graphics cards, motors, power products, and other areas.

Cu Clip has 2 bonding techniques.

All copper sheet bonding method

Both eviction pad and the Source pad are clip-based. This bonding method is a lot more pricey and complicated, but it can accomplish far better Rdson and better thermal results.

( copper strip)

Copper sheet plus cord bonding technique

The resource pad makes use of a Clip technique, and eviction makes use of a Cable method. This bonding technique is somewhat cheaper than the all-copper bonding technique, saving wafer location (appropriate to very little gate locations). The process is less complex than the all-copper bonding technique and can obtain much better Rdson and better thermal effect.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper wire scrap price per kg, please feel free to contact us and send an inquiry.

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